Screen printable, non-fire-through copper paste applied as busbar metallization for back contact solar cells

Dominik Rudolph, Rüdiger Farneda, Tudor Timofte,Andreas Halm,Ning Chen,Joris Libal,Florian Buchholz, Isaac Rosen, Michael Grouchko, Ofer Shochet

PROCEEDINGS OF THE 10TH WORKSHOP ON METALLIZATION AND INTERCONNECTION FOR CRYSTALLINE SILICON SOLAR CELLSAIP Conference Proceedings（2022）

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busbar metallization,copper paste,solar cells,back contact,non-fire-through

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