Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles

IEEE Transactions on Device and Materials Reliability(2023)

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摘要
Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-sided cooling power modules developed by institutes or companies are introduced in detail. The challenges and future trends of double-sided cooling power modules are also highlighted.
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关键词
Wires,Multichip modules,Bonding,Substrates,Inductance,Heating systems,Integrated circuit interconnections,Power modules,packaging,double-sided,wireless,electric vehicles,automotive
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