ZrAlx Oy high-k dielectrics for MIM decoupling capacitors in the BEOL
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)(2023)
摘要
A material, electrical and reliability study of MIM decoupling capacitors placed in the BEOL of 300mm wafers using Al
2
O
3
-doped ZrO
2
dielectric thin films is reported. By using two aluminum contents (7.8% and 13.1%) within thin (<10nm) ZrO
2
dielectric films, the capacitance density of up to
$25.7\ \text{fF}/\mu\mathrm{m}^{2}$
with field linearity of 592 ppm/(MV/cm)2 at 10kHz was achieved. J-E curves and dielectric breakdown characteristics at temperatures from 25°C to 150°C were investigated. Low leakage current
$(< 0.1\mu\mathrm{A}/\text{cm}^{2})$
was achieved up to 200°C for both Al contents. Further, reliability measurements were carried out over temperature (25-175°C). Capacitors reached more than 300 years of extrapolated lifetime for the 13.1% Al content within ZrO
2
at 150°C and up to more than 400 years of lifetime for both Al contents at 25°C.
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