Advanced Fabrication of Vacuum Electron Devices
IEEE Transactions on Electron Devices(2023)
摘要
RF source scientist and engineers continuously push the envelope with new designs, striving for improved performance with higher efficiency, higher frequency, greater bandwidth, increased gain, smaller size, lower voltage, and myriad other parameters required for ever more demanding applications. Invariably, it becomes more challenging to achieve the required fabrication and assembly performance with increasing complexity and precision. This publication reviews recent development on advanced fabrication technologies and describes the current state of the art in machining, assembly, and alignment capabilities.
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关键词
Radio frequency,Cathodes,Wires,Fabrication,Metals,X-rays,Solid modeling,Additive manufacturing (AM),cathodes,diffusion bonding,elastic averaging,electrodischarge machining,kinematic coupling,liquid phase bonding,lithographic machining,machining,microcomputer numerically controlled (CNC),nano-CNC,reservoir cathodes,scandate cathodes
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