Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging

With the trends of high power and miniaturization of power electronics, thermal management is becoming to an emergency issue. To solve this, a real time thermal measurement system was proposed. In this study, the SiC-TEG (Thermal Engineering Group) heater chip was designed, which plays a high-density heat source in the system. Simulation results indicated heat was transferred to cooling plate through die attach materials and DBC substrate, so that the thermal resistance can be calculated. In addition, the uniformity of heater chip also evaluated. The optimized heater chip may improve the precision of the thermal measurement system.