Introduction to the Special Issue on CAD for Security: Pre-silicon Security Sign-off Solutions Through Design Cycle.

ACM J. Emerg. Technol. Comput. Syst.(2023)

引用 0|浏览14
暂无评分
摘要
This introduction welcomes all readers to this ACM JETC special issue on CAD for Security: Pre-silicon Security Sign-off Solutions Through Design Cycle. The articles published in this special issue reflect how computer-aided design (CAD) tools are developed to expand the notion of automated security verification throughout the system-on-chip (SoC) design cycle. This special issue aims to demonstrate how the semiconductor industry must look for security-oriented metrics and evaluation as part of automatic CAD solution development to aid analysis, identifying, root-causing, and mitigating SoC security problems. Throughout this introductory note, we first represent the need for such a security-oriented sign-off solution for the ASIC design flow, then it is followed by providing an overview of the articles published in this special issue and how they address such requirements.
更多
查看译文
关键词
cad,design cycle,security,pre-silicon,sign-off
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要