3D-FEM thermal transfer analysis of MEMS-based thermal infrared emitter integrated with microchannel heatsink

Zile Huang, Weiyu Wang, Jiaming Xu, Songqing Zhao, Haiyan Chen, Binbin Chen, Chunquan Zhang,Shenglin Ma,Haisheng San

Infrared Physics & Technology（2023）

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摘要

•A Si-based microchannel heatsink was used to improve the transient response characteristics of IR emitter.•A 3-D FEM was used to analyze the electrical-thermal and heat transfer behaviors of devices.•The devices performance can be improved when the flow velocity of coolant is larger than 0.5 m/s.

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关键词

Si-based structure,MEMS infrared emitter,Microchannel heatsink,Thermal transfer simulation

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