Effect of annealing process on interface microstructure and mechanical property of the Cu/Al corrugated clad sheet

In this research, annealing treatment was performed on the Cu/Al corrugated clad sheets fabricated by the corrugated cold roll bonding (CCRB) process. Interface microstructure evolution, interface phase development, intermetallic compound (IMC) growth kinetics, interface bonding strength, and electrical resistivity at various positions of the Cu/Al corrugated clad sheet were investigated under different annealing conditions. The IMC layers (CuAl2, Cu9Al4 and CuAl) with uneven thickness were formed at the Cu/Al corrugated interface during the annealing process. Interface defects caused by shear deformation can effectively reduce the growth activation energies of IMC sub-layer at positions I (back waist), III (front waist), and IV (trough). On the contrary, the interface brittle layers and overlayer can slightly increase the activation energy at position II (peak). The sequence of growth activation energies for IMC sub-layer was QCuAl更多