Special Issue "Thin Films and Nanostructures by MOCVD: Fabrication, Characterization and Applications-Volume II"

In our world dominated by global communications, data centers, travels and environmental concerns, there is an increasing need for the deposition of materials with competitive quality, thruput, and relatively low cost/impact, to be implemented in smart devices capable of integrating complex systems, such as the emerging Internet of Things (IoT) [...]