Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development

•A high-temperature resistant cyclosiloxane-containing photosensitive resin was developed solventlessly with thiol-ene click reaction for DLP 3D printing.•The stability, rheological and photo-rheological properties of the resin are systematically investigated, reveling the low viscosity (<350 mPas) and fast UV curing rate (gel time < 0.5 s).•The 3D-printed silicone was ceramized at 800 °C, preserving its original form with a small shrinkage of 25%.•Nano-functional composites were 3D printed with the cyclosiloxane-containing ink as matrix for photothermal conversion and anti-counterfeiting identification.