Simulation analysis of electromagnetic pulse susceptibility and hardening design for system-in-package SZ0501

The electromagnetic pulse (EMP) susceptibility of System-in-Package (SiP) SZ0501 was investigated by field-circuit combination simulation method in this paper. The electromagnetic pulse coupling model of the SiP is established by an electromagnetic field simulation software (CST). Considering different incident and electric field direction, the type and distribution of pins, the coupled voltages via pins of the SiP under EMP were obtained to analyze the electromagnetic susceptibility of the SiP. Simulation results indicate five major factors affecting the electromagnetic susceptibility of the SiP: the effective electric field integration on the pins, the distribution of pins, the terminal cases of pins, the shunt effect of the output ports of the power plane, and the kind of ground planes. And compared with side incidence, SiP is more sensitive to EMP from above. Finally, some factors affecting the shielding effect are considered, a shielding box is designed and then verified to reduce the electromagnetic susceptibility.