III-V/III-N technologies for next generation high-capacity wireless communication
2022 International Electron Devices Meeting (IEDM)(2022)
摘要
In this paper, we will discuss the progress that has been made in upscaling GaN and InP to a Si platform as well as making them CMOS and 3D compatible to enable the heterogeneous systems that will be needed for 5G mm-wave and 6G sub-THz frequencies for high-capacity wireless communication.
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关键词
high-capacity
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