Numerical investigation on Sn-rich solder joints failure mode: Effects of the thermomechanical anisotropic performance

Zhao Zhang,Kun Ma,Kang Liang,Fang Dong,Zhengfang Qian,Sheng Liu

Engineering Failure Analysis（2023）

引用 1|浏览12

暂无评分

摘要

•Grain orientation has a crucial effect on the fatigue mode of Sn-rich solder joints.•A new failure mode of Sn-rich solder joints in SiP was found.•Traditional fatigue life prediction model for Sn-rich solder joints is questionable.

查看译文

关键词

Failure mode,Sn-rich solder joints,Thermal cycle loading,Anisotropic constitutive model

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要