System Integration Technology Based on 3D Integration

2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)（2022）

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摘要

A heterogeneous 3D system integration technology is the key technology to achieve future high-performance and energy efficient systems such as high-performance computer system, AI system, post 5G/6G system and quantum computing system. Current status and future prospect of heterogeneous 3D system integration technology are discussed.

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关键词

Keywords-3D-integration,heterogeneous-integration,chiplet integration,AI,post5G/6G,Quantum computer

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