A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices

Nowadays, the local heat accumulation of electronic components not only restricts the further miniaturization and integration of electronic devices but also seriously affects the performance and lifetime of the devices. Polymeric materials are potential candidates for effective thermal management, and improving the lower intrinsic thermal conductivity (TC) of polymer is essential to solving the efficient discharge of the accumulated heat. Meanwhile, it is important to ensure good electrical insulation for the material’s applications on specific occasions. This work systematically reviews the recent development in the preparation strategies and practical applications of thermally conductive and electrically insulating polymeric materials. The authors also summarize the thermal and electrical performance evolution of each sample prepared by a specific strategy, which provides guidelines for designing novel polymer-based thermal management materials. The application section covers the employment of materials in the field of heat dissipation of electronic devices, including microelectronics and battery packs. Finally, the challenges and prospects of thermally conductive and electrically insulating polymeric materials are also discussed. Graphical abstract