ESD Verification of a 2.5D CoWoS Package Design

Sen Cao,Chenfei Wu, Guohua Zhou,Keqing Ouyang, Quan Yan

2022 International EOS/ESD Symposium on Design and System (IEDS)（2022）

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摘要

In 2.5D chip-on-wafer-on-substrate (CoWoS) package designs, electrostatic discharge (ESD) protection must cover both individual dies and interposer. We expanded ESD design rules to the interposer, and used the foundry PDK to check die-level ESD requirements. We ran checks using Calibre PERC software, then compared results against post-silicon ESD test results.

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