Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction

Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m −1 K −1 and contact thermal resistance as low as 4–6 K mm 2 W −1 (double sides). The liquid metal acts as a buffer layer to connect vertically aligned graphene with the rough heater/heat sink, improving effective contact thermal conductance by more than an order of magnitude.