Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)(2022)

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摘要
In this contribution, we propose a novel approach to rigorously model interconnect structures with an arbitrary convex polygonal cross-section and general, piecewise homogeneous, material parameters. A full-wave boundary integral equation formulation is combined with a differential surface admittance approach, invoking an extended form of the numerically fast Fokas method to construct the pertinent operator. Several examples validate our method and demonstrate its applicability to per-unit-of-length resistance and inductance characterization.
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关键词
differential surface admittance,Fokas method,interconnect modeling
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