Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology

IEEE Transactions on Components, Packaging and Manufacturing Technology(2022)

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摘要
A new class of 3-D integrated multiband bandpass filters (BPFs) based on substrate integrated waveguide (SIW) technology is presented in this work, for the first time. Split-type dual-extended doublet (SDED) coupling topologies are developed to propose these BPFs with a desired multiband response by the LEGO-style assembly of planar SIW resonant-mode blocks. These design schemes offer attractive and promising advantages with regard to compact size, low cost, flexible and expandable topology, as well as integration of high-density integrated circuits. For demonstration, dual- and triple-band BPFs are designed, fabricated, and measured. The measurement results are in good agreement with the simulation ones. Results indicate that the proposals can provide not only nice selective multiband signal transmission in such flexibly extensible topologies with new spatial schemes but also increase space utilization and reduce footprint.
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关键词
3-D,bandpass filter (BPF),LEGO-style,multiband,split-type dual-extended doublet (SDED),substrate integrated waveguide (SIW)
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