Comparative Analysis on Switching Characteristics of Discrete SiC MOSFET in Press-pack Package and Wire-bonded Package
2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC)（2022）
Key words
press-pack package,SiC MOSFET,discrete device,package parasitic inductance,switching loss
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined