Secure Interposer-Based Heterogeneous Integration

M. Shafkat M. Khan,Chengjie Xi,Aslam A. Khan,M. Tanjidur Rahman,Mark M. Tehranipoor,Navid Asadizanjani

IEEE Design & Test（2022）

引用 11|浏览8

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摘要

Interposers are used to connect chiplets when building a heterogeneous SoC. Interposers come with their own unique security threats. They also present opportunities for securing such systems. This article discusses some of them.

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关键词

Interposer Packaging Security,Packaging Assurance,Heterogeneous Integration,2.5D and 3D Integration Security

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