Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

A facile blade-coating process is developed for large area deposition of uniform thick organic active layers in organic photodiodes (OPDs). Large-area semi-transparent top metal electrodes are thermally evaporated with an optimal deposition rate to achieve good balance between transparency and conductivity for top illumination integration structure with the organic thin-film transistor (OTFT) backplane. The maximum process temperature of the OPD is 85 degrees C, so that the performance of the OTFT underneath is not affected. Based on the developed integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, having the largest size (130 mm x 130 mm), highest resolution (1536 x 1536 pixels, 300 ppi) and lowest process temperature (100 degrees C) reported so far for the OPD based imagers.