Statistical Characterization of ESD through Solder Paste

Junsoo Paek,Rita Fung,Richard Wong, Geronimo Filippini, Jeff Kendo, Allen Zhao

2020 42nd Annual EOS/ESD Symposium (EOS/ESD)（2020）

引用 0|浏览2

暂无评分

摘要

Few models exist to characterize the electrical properties of un-reflowed solder paste. As such, determining whether ESD could occur through un-reflowed solder paste is difficult. To evaluate the risk of a discharge through un-reflowed solder paste, an automated fixture is used to create and measure field induced discharges.

查看译文

关键词

field induced discharges,unreflowed solder paste,ESD,statistical characterization

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要