谷歌浏览器插件
订阅小程序
在清言上使用
VIPCreated with Sketch.

Characteristic Analysis of a Multi-chip Embedded Interposer Carrier Using a Wafer- Level Fan-Out Process

Ching Kuan Lee, Wen-Hung Liu, Shu-Yi Chang,Ren-Shin Cheng,Yu-Min Lin,Hsiang-En Ding,Wei-Lan Chiu,Tao-Chih Chang,Chia-Hsin Lee,Chang-Chun Lee

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)（2022）

引用 0|浏览13
关键词
Embedded Interposer Carrier,fan-out process,multichip
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要