A Low Profile Two-phase Immersion Cooling Stack-up based on Detachable Boiling Enhancement Layer on Lidded Electronic Packages

A way to incorporate a boiling enhancement layer (BEL) directly onto a lidded electronic package is proposed to improve boiling performance of lidded electronic packages for server Central Processing Unit (CPU)/(Graphics Processing Unit) GPU in two-phase immersion cooling. The proposed method not only accounts fir thermal improvements, hut also takes into consideration assembly and serviceability aspects of electronic package design. Consequently, the proposed approach will not only improve cooling performance over standard lidded electronic package, but also flexibility in the design of lidded electronic packages in two-phase immersion cooling applications.