Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)（2022）
Key words
HBM,HBM2e,high density organic interposer,signal integrity,timing margin,ANSYS HFSS,high speed interconnects,Heterogeneous Integration,HI
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