Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)(2022)
摘要
We have investigated the effect of an extremely large and relatively ordered Cu grains on the yield of Cu-Cu direct bonding/Cu-SiO2 hybrid bonding. Both modified electroplating method and the post processing have resulted into the formation of 10 - 15 mu m large Cu grains before Cu-Cu direct bonding/Cu-SiO2 hybrid bonding. Employing such large and oriented grains, we have successfully carried out Cu-SiO2 hybrid bonding using 5 pun-size Cu electrodes at 10 mu m-pitch values. The microstructural evaluation confirmed the formation relatively oriented Cu-grains. The more tensile nature of oriented Cu grains formed by modified electroplating and post processing might facilitate the Cu diffusion during the Cu-Cu direct/Cu-SiO2 hybrid bonding.
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关键词
Cu-grain enlargement, Oriented Cu grains, Cu-Cu direct bonding, Cu-SiO2 hybrid bonding
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