Electrical Locating Technology for Failure Point Location Based on an Amplifier Module

A boom in microsystem modules has brought with it increasingly integrated internal chips that are smaller and smaller in feature size. Meanwhile, multilayer wiring has also got more complicated. Consequently, locating failure points in these chips - a crucial link in module failure analysis technologies - is becoming even harder, through electrical methods or otherwise. This article revolves around a type of amplifier module suffering a failure. Alongside traditional failure analysis methods, electrical techniques of infrared hotspot, isolation testing and surface delayering are employed to successfully diagnose the failure, including the location and appearance of the failure point. Findings in this article are hoped to facilitate future development of internal electrical locating technologies for module failure analysis.