Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)（2022）
Key words
High bandwidth memory (HBM),thermal characteristics,thermal simulation model,2.5D Si-interposer System,stack thermal resistance,multi-chip package
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