Analysis and Research About Different Cooling Structures of Piezoelectric Fans

2022 International Conference on Computer Engineering and Artificial Intelligence (ICCEAI)(2022)

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摘要
In this paper, several different piezoelectric fan cooling forms are designed for a certain electronic equipment. The heat dissipation effect is simulated by CFD thermal simulation software to verify thermal performance differences under different installation structures and materials. Through the simulation and comparison of the horizontal installation, vertical installation, different case material, and installation layout of piezoelectric fans. The analysis data that is beneficial to engineering practice is obtained, and the structure form that is more beneficial to heat dissipation is selected accordingly to guide the subsequent practical application. The paper also analyzes several possible improved structures of piezoelectric fans in the future.
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关键词
Piezoelectric fan,CFD thermal simulation,Air-cooled heat transfer,Heat dissipation performance
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