Editor’s notes:
The ”chiplet” components that, after stacking, constitute a multidie package, can be complex system-on-chips in their own right. Consequently, IEEE Std 1838, the recently released standard for test access in 3-D die stacks, potentially interacts with many other Design-for- Test (DfT) standards, which all might have been used in these chiplets. This article provides a guided tour through the growing set of IEEE DfT standards in the context of an IEEE 1838-compliant design.
—Erik Jan Marinissen, imec
