Performance Analysis of the Analog Path of Read-Out Integrated Circuit for MEMS structures under Temperature Variation
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)（2022）
摘要
The paper presents a time-analysis of capacitive analog readout circuit properties for a range of operating temperatures. Comparison of schematic-based and post-layout extraction-based behavior is conducted, and the analysis includes and compares simulation and measurement results. The presented analysis identifies the temperature-relation of the circuit readout values as well as shows the influence of environment temperature on noise levels.
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关键词
mems structures,integrated circuit,analog path,temperature variation,read-out
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