Additively Manufactured “Smart” RF/mm-Wave Packaging Structures: A Quantum Leap for On-Demand Customizable Integrated 5G and Internet of Things Modules

Xuanke He,Kexin Hu,Yepu Cui,Ryan Bahr,Bijan Tehrani,Manos M. Tentzeris

IEEE Microwave Magazine（2022）

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摘要

5G and Internet of Things (IoT) technologies are rapidly expanding fields, utilizing cutting edge processes and manufacturing techniques that enable wide connectivity coverage and promise to connect billions of devices in all different types of environments. This critical requirement of ubiquitous implementation necessitates an adaptive system that can be easily modified on demand to be utilized in different areas of deployment.

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关键词

quantum leap,Internet of Things technologies,manufacturing techniques,wide connectivity coverage,additively manufactured smart rf/mm wave packaging structures,5G,cutting edge processes,ubiquitous implementation

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