Cost-Effective Technologies for Next-Generation System on Package: Multilayer Transmission Lines and Interconnects for 5G and Millimeter-Wave

The demand for millimeter-wave (mm-wave) technology is growing rapidly for commercial as well as military applications due to its inherent advantages such as high speed, bandwidth, and resolution. These applications include broadband wireless (together with 5G and Beyond), multimedia, the Internet of Things (IoT), space and defense, automotive radar, imaging sensors, and biomedical devices [1] – [3] . For these applications, integration and packaging of mm-wave modules in a compact size yet at a low cost while maintaining high reliability and repeatability is the key challenge to industries [2] – [4] . The multilayer/3D multichip module (MCM) or system-in/on-package (SiP/SoP) with antenna-in-package technologies, with high-quality (high-Q) off-chip passive components and interconnects, are widely regarded as excellent means for meeting these advanced requirements [5] – [7] .