Temporary bonding system with photopolymer release layer for 365nm UV debonding without laser

Herein, a temporary bonding system consisting of photopolymer release materials UDP 801 and temporary bonding materials WLP TB150 has been successfully developed (UDP 801 as UV release layer, WLP TB150 as adhesive layer), which can be debonding by UV lamp irradiation, unlike the costly UV laser debonding in temporary bonding technology. The results show that the photopolymer release materials UDP 801 not only has excellent UV absorption, the transmittance in the 365nm band is less than 7%, but also has good thermal stability, 5% weight loss temperature is more than 270°C in nitrogen atmosphere. Thin wafer bonding pairs can be separated at room temperature, quickly and low stress by UV lamp irradiation. Compared with laser debonding solutions, this newly developed technology does not require expensive laser equipment, has higher processing efficiency, and provides an attractive solution for temporary bonding technology.