Recrystallization behavior and texture evolution on extrusion connection process of Mg/Al alloys thickness-oriented bonding sheet

Mg/Al alloy thickness-oriented bonding sheet extrusion is a new type of solid-state connection process for dis-similar metals, but metal flow during extrusion is complex, and the texture evolution law of the matrix on both sides is not clear. In this paper, the electron backscatter diffraction (EBSD) was used to observe the texture evolution and recrystallization behavior of the matrix on both sides of the extruded AZ31/AA6061 bonded sheets at different temperatures. Research indicates that AZ31/AA6061 has the highest bond strength (42 MPa) at T = 390 degrees C, and magnesium alloy has a lower texture intensity. The extrusion process of the thick bonded sheets will promote the dynamic recrystallization (DRX) of AZ31 magnesium alloy. When T = 420 degrees C, grain refinement is caused by both discontinuous dynamic recrystallization (DDRX) and continuous dynamic recrystallization (CDRX). The {110} < 113 > texture intensity of AA6061 aluminum alloy gradually weakens with the increase of forming temperature, {110} < 100 > texture is enhanced instead, and the maximum pole density of the pole figure is decreased.