Security Assessment of IC Packaging Against Optical Attacks
EDFA Technical Articles(2021)
摘要
Abstract The inverted orientation of a flip-chip packaged die makes it vulnerable to optical attacks from the backside. This article discusses the nature of that vulnerability, assesses the threats posed by optical inspection tools and techniques, and provides insights on effective countermeasures.
更多查看译文
关键词
ic packaging,security assessment,optical,attacks
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要