Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes

Shifei Han,Haijuan Yu,Chaojian He,Shusen Zhao,Chaoyu Ning,Lu Jiang,Xunchun Lin

Optics & Laser Technology（2022）

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摘要

•Picosecond laser-induced multiphoton processes was experimentally demonstrated.•Thinner 250 μm 4H-SiC wafers were obtained using the picosecond laser slicing.•The structure and composition of 4H-SiC after laser modification were investigated.

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关键词

Silicon carbide,Picosecond laser,Multiphoton effect,Etching

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