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Investigation on the Effects of Interconnect RC in 3nm Technology Node Using Path-Finding Process Design Kit.

Yeji Lee, Wonyeong Jang, Kyungbae Kwon,Jihun Park,Changhyun Yoo,Jeesoo Chang,Jongwook Jeon

IEEE Access(2022)

Cited 12|Views11
Key words
Gate-all-around FET,process design kit,parasitic extraction,benchmark,air spacer
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