Investigation of Vehicle- oriented Double-sided Cooling power module with BGA technology

With the increasing power density and integration of power electronics for motor drive applications, lower parasitic parameters, higher heat dissipation, thermomechanical reliability, and manufacturability have become the focused requirements of automotive power modules. New structures and materials have been investigated for the packaging of power modules, and wire-bondless packaging technology has become a research focus. In this article, a wire-bondless power module packaging technology based on ball-grid array (BGA) was developed, and a double-sided cooling (DSC) power module was then fabricated and thoroughly investigated. Thermal, electrical, and mechanical properties of the BGA packaged module were analyzed from the aspects of electrothermal coupling, shear performance, and electrical test. Specifically, by using the BGA interconnection, the thermal resistance was decreased by 27.4% compared to the wire-bond module. Parasitic inductance of BGA-based module was measured to be 10.13 nH by the dynamic test under the conditions of 310 V/120 A, which decreased by 33.3% compared to the wire-bond module counterpart. The findings of this work can help advance the design and fabrication of power modules, specifically DSC power modules.