Monolithic Integration of a Wafer-Level Thin-Film Encapsulated Mm-Wave RF-MEMS Switch in BEOL of a 130-Nm SiGe BiCMOS Technology
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2022）
Key words
Bipolar CMOS (BiCMOS),millimeter-wave (mm-wave),packaging,RF-microelectro-mechanical-system (MEMS) switch,wafer-level thin-film encapsulation (WLE)
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