Improving the interfacial bonding of CNT/Cu composites using CPD bridges

A hybrid reinforcement of carbon nanotubes and carbonized polymer dots was created and used to strengthen the copper matrix by a powder metallurgy method. The CPD-CNT/Cu composite exhibits excellent strength-ductility balance, the yield strength and tensile strength of the composites reach 195 MPa and 306 MPa, which are ∼109.5% and ∼43.5% higher than those of pure copper (93 MPa and 213 MPa), respectively; the elongation is (29%) as high as that of the copper matrix (28%). More importantly, the CNT-CPD/Cu composite exhibits a significantly higher electrical conductivity than the CNT/Cu counterpart (88.3 %IACS). The synergistic effect of the CPD and CNT is ascribed to the bridging role of the CPD in enhancing the interface between CNT and Cu matrix, which can also take full use of the electrical properties of the CNT. Our findings point to crucial tactics and areas for further research and development of copper-based composite materials.