Vertically stacked multilayer atomic-layer-deposited sub-1-nm In₂O₃ field-effect transistors with back-end-of-line compatibility

In this work, we demonstrate vertically stacked multilayer sub-1-nm In2O3 field-effect transistors (FETs) with surrounding gate in a back-end-of-line (BEOL) compatible low-temperature fabrication process. A typical bottom-gated single layer In2O3 FET with maximum on-state current (ION) of 890 μA/ μm at VDS = 0.8 V and an on/off ratio over 106 is achieved with a channel length (Lch) of 100 nm. The effects of HfO2 capping and O2 annealing are systematically studied, which is critical to realizing the multilayer FETs. Each atomically thin In2O3 channel layer with a thickness (TIO) of 0.9 nm is realized by atomic layer deposition (ALD) at 225 °C. Multilayer FETs with a number of In2O3 layers up to 4 and 1.2 nm-thick HfO2 between each individual layer are fabricated. An enhancement of on-state current (ION) from 183 μA in a single layer In2O3 FET to 339 μA in a 4 layer device with an on/off ratio of 3.4 × 104 is achieved, demonstrating the key advantage of the multilayer FETs to improve the current. Several critical features, such as large-area growth, high uniformity, high reproducibility, ultrathin body, flexibility, and BEOL compatibility, have turned ALD In2O3 into a noteworthy candidate for next-generation oxide semiconductor channel materials.