3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence SystemKatsuyuki Sakuma,Mukta Farooq,Paul Andry,Cyril Cabral, Thomas Wassick, Dale McHerron,Rama DivakaruniIEEE Transactions on Components, Packaging and Manufacturing Technology（2021）引用 0|浏览1暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
