CMOS Reliability From Past to Future: A Survey of Requirements, Trends, and Prediction Methods

Ian Hill,Parvez Chanawala, Rohit Singh,S. Arash Sheikholeslam,Andre Ivanov

IEEE Transactions on Device and Materials Reliability（2022）

引用 7|浏览3

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摘要

Developments in IC fabrication, emerging high-reliability markets, and government regulations indicate potential for significant shifts in how reliability fits within IC development and product life-cycles. This survey takes a comprehensive look at trends in IC reliability and investigates the methods used to predict failures. A background overview of recent and expected advances in IC fabrication...

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关键词

Reliability,Integrated circuits,Integrated circuit reliability,Market research,Fabrication,Materials reliability,Degradation

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