High thermal conductivity diamond-doped silver paste for power electronics packaging

Materials Letters(2022)

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摘要
•A kind of silver paste doped with Ag/TiC double-coated diamond was developed.•The thermal conductivity of the sample doped with 25% diamond increases by ∼74%.•The effect of diamond particle size, coating and concentration was investigated.•The electrical and mechanical properties of composite paste were evaluated.
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关键词
Adhesion,Sintering,Thermal properties,Ag/TiC double-coated diamond,Diamond-doped silver paste
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