Low-temperature curable and low-dielectric polyimide nanocomposites using aminoquinoline-functionalized graphene oxide Nanosheets

Low-temperature curable and low-dielectric polyimides (PIs) are required in wafer-level packaging (WLP) which is an advanced microelectronic packaging technology. Herein, a low-cost and multifunctional nanofiller (aminoquinoline-functionalized graphene oxide, AQL-GO) is synthesized, which ingeniously achieved the abovementioned requirements of polyimide nanocomposites by nucleophilic attack of QL and chaotic packing of the polymer chain. The results show that the nanocomposite can be fully cured at only 200 degrees C and have a low dielectric constant (2.96@1 MHz) with 0.5 wt% addition of AQL-GO. Furthermore, the mechanical and thermal properties of all nanocomposites cured at 200 degrees C (the elongation at break can reach 39.69%, the Young's modulus can reach 2.38 GPa and T5% can reach 530.55 degrees C) are almost equal or even better than those of pure PI cured at 350 degrees C. Therefore, the PI/AQL-GO nanocomposites have industrial prospects in advanced microelectronic packaging.