Design, Materials, Process, Fabrication, and Reliability of Mini-LED RGB Display by Fan-Out Panel-Level Packaging

In this study, the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are Red (125 ×250 ×100μm), Green (130×270×100 μm), and Blue (130 ×270×100μm). The spacing among the RGB mini-LEDs is 80μm, the pixel-to-pixel spacing is also ~ 80μm, and the pixel pitch is 625μm. The temporary glass panel for making the RDLs of the package is 515 ×510×1.1mm in size. In order to increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into 4(2×2 pixels) in one SMD (surface mount device), i.e., a total of 12 R, B, and G mini-LEDs. A PCB (132mm×77mm) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation.