Challenges for Automating Package Routing

Wen-Hao Liu, Bing Chen, Hua-Yu Chang, Gary Lin, Zi-Shen Lin

International Symposium on Physical Design(2022)

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摘要
ABSTRACTPackage routing is typically done by semi-auto or manual manners in order to meet several customized requests for different design styles. However, in recent years, the scale of package designs rapidly enlarges, and routing rules become more and more complicated, such that the engineering effort of the manual solution increases dramatically. Therefore, the need of full-auto solution becomes necessary and critical. In addition, in order to build an automatic design flow for 3D-IC, full-auto package routing is one of most important pieces. There are many challenges for realizing full-auto package routing solution. Some of the challenges will be introduced in this paper.
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关键词
Package routing, 3D-IC, chip-package-board co-design
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