CMOS-MEMS Multi-Sensor Single Chip with High Heat Dissipation and Low-Temperature Hermetic Sealing
2021 IEEE International Electron Devices Meeting (IEDM)（2021）
Key words
high-thermal-conductivity silicone rubber,unsealed vacuum sensors,sealed vacuum sensor,thermal effect,CMOS-MEMS multisensor,single chip,high heat dissipation,three-axis CMOS-MEMS accelerometer,chopper-stabilized,calibration readout circuit,MEMS resonator oscillator,Pirani vacuum sensor,low-temperature hermetic sealing,minimum output noise floor,minimum output DC,chopper amplifier,phase noise,integrated sensing chip,standardized CMOS-MEMS technology,flip-chip bonding technology,voltage 40.0 mV,frequency 185.0 kHz
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